Laser cutting

The laser can handle a variety of cutting tasks.These range from micrometer-precise cutting joints in paper-thin semiconductor chips to quality cuts in 30-millimeter-thick steel. In laser drilling, the laser beam generates very small to large holes in metals, plastics, paper and stone, without contact.

Address

33755 桃園市大園區中正東路

             三段490號

Call

Tel: 03-381-4497
Fax:   03-381-4536

Mobile:0936-388-287
 

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